Afleveringen
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In this kickoff episode, Ryan Miller makes the case for why thermal management needs to be on the minds of the designers. But what are the main causes of excess heat in our designs today? Join us as we start by defining the problems, then turn to the array of solutions.
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Scott Miller and Brian White join host Nolan Johnson to discuss Miller's book, The Printed Circuit Designer's Guide to Executing Complex PCBs. Miller and White add insight to the seven key disciplines required by designers to successfully design complex PCBs. Of course, in this fast-moving industry, they also provide updated perspectives.
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Zijn er afleveringen die ontbreken?
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In this episode, my guests are Julie Cliche-Dubois, product manager at Cogiscan, and Andres Luna, general manager at Univertools. Univertools represents Cogiscan in Mexico. Julie is the author of the recently published book, "The Printed Circuit Assembler's Guide to Factory Analytics.” In this episode, we're discussing the evolving role of data analytics, with an eye toward how analytics is driving meaningful action throughout the electronics manufacturing industry in Mexico and the rest of the Americas.
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The panel full of circuit boards has completed the manufacturing process. We end this journey by routing the panel into individual boards, performing a final inspection, and packaging for shipment.
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Nearly finished, phase two of the wrap-up is to apply surface finish to protect that copper from oxidation and to facilitate soldering the components to the board.
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By this point, we have a functioning PCB, but there is still more to do in order to keep the board safe from environmental effects, and also document the circuit components. In this episode, we cover the topics solder mask and silkscreen.
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At this stage in the process, we have a panel comprised of all the internal layers laminated together, through-holes are drilled, and the outer layer copper features have been covered with a protective layer of tin. Join us as Matt Stevenson walks us through the process sequence for outer layer strip, etch, and strip.
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Our series on Intelligent System Design continues with a discussion on integrating board data with mechanical data. Cadence's Vince DiLello joins us to remove the mystery of connecting PCB and mechanical design flows. DiLello explains the current state and describes what he sees in the future.
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This is where fabrication gets wild—pattern plate. All the prep work has set up the board to receive the copper traces, pads, and other elements as specified by the designers in the original CAD design. Here, Matt Stevenson describes not only the process but many of the constraints in the chemistries that must be managed to deliver the customer's exacting manufacturing tolerances.
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Product engineering expert Mark Hepburn joins the podcast to discuss the value of collaboration in the printed circuit board design and manufacturing cycle. Hepburn shares his views on how the latest data infrastructures are changing and enabling greater—and safer—data sharing.
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Each circuit board is composed of a one-of-a-kind pattern of metal connections representing the specific design for that circuit. So, how do those unique features get mapped onto the board? Find out in this episode as Matt Stevenson paints a picture of the outer layer imaging process.
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In this episode, we continue the theme of bringing more decision-making power to the design process. This time, we're talking with Supreeth Mannava about bringing more "power" (and "signal") to the electrical engineer.
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Now it's time to start getting into the chemistry! In this episode, Matt Stevenson describes the first key step in turning design data into physical reality - preparing the circuit board substrate material for fabrication. It's not as straightforward as you might think.
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Cadence's Brad Griffin joins us in this episode where we discuss how an intelligent system design methodology can move some signal and power integrity decision making into the physical design space, offering real-time feedback.
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Nolan Johnson and Matt Stevenson continue down the manufacturing process, this time focusing on the post-lamination drilling process for PCBs. Matt and Nolan delve into the intricacies of the PCB drilling process, highlighting the importance of hole quality, drill parameters, and design optimization to ensure smooth manufacturing. The conversation covers topics such as drill bit sizes, aspect ratios, vias, challenges in drilling, and ways to enhance efficiency in the drilling department. The discussion also covers the critical relationship between design choices and manufacturing capabilities. Finally, they touch upon the subsequent steps of metalizing the drilled holes through an electrolysis process.
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Patrick Davis returns to the podcast to talk about design rules. As design considerations become more and more complex, so too do the rulesets designers must abide by. But rather than seeing them as impossible sets of constraints, Davis shares a vision in which designers can maximize their creative efficiencies while relying on ever more complex design rules to keep everything straight.
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Multilayer boards bring along a completely different set of processes. In this installment of “On The Line With…” Matt Stevenson discusses manufacturing techniques for multilayer. Of course, this necessitates a review of drill and registration techniques, followed by the ins and outs of lamination.
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In this episode, our guests are Taylor Hogan and Patrick Davis. We discuss the role Artificial Intelligence (and Machine Learning) play in intelligent system design.
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Now it’s time to roll up our sleeves and get “messy.” Once the CAM preparations are complete, Matt Stevenson explains what happens next. In this episode, Matt Stevenson details the role of materials, stackup considerations, and walks us through what happens in the Imaging process.
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To launch this series on integrated system design, we ask Cadence's Patrick Davis why we need to change how we design printed circuit boards in the first place. Davis explains how the interrelated shifts in design requirements are changing the methods we use.
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