Afleveringen
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The promise of wide-bandgap semiconductors like Silicon Carbide (SiC) and Gallium Nitride (GaN) are finally being manifested in advanced products and solutions for power electronics. In this episode, we talk to Andy Smith of Power Integrations about the latest developments in the space.
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The power electronics industry has been thrown into a state of disruptive evolution with the advent of wide-bandgap semiconductors and the resulting advanced circuit topologies. In this episode, we talk to Guy Moxey, the VP of Power Development at Wolfspeed, about the state of wide-bandgap power electronics.
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Zijn er afleveringen die ontbreken?
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400 G copper cables make up the bulk of connections in data centers these days with 800 G and 1.6 T on the horizon. Active electrical cables (AECs) are a requirement for copper cabling
In this episode of Inside Electronics, William Wong talks with Point2 Technology's David Kou about AECs including their new Point2 P1B121 integrated, eight-unidirectional SerDes with smart Clock Data Recovery (CDR) and retimer functions that support 112G PAM4 needed for 800 G copper cabling.
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In this episode, Alix Paultre will talk about his impressions and thoughts from the recent electronica show in Munich, Germany. From the hot topics to the cool technology, the show had a lot of interesting elements.
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Insane levels of electrical power are needed to support AI in datacenters, and the electrification of mobility means development of remote locations for the extraction of critical mineral resources including the powering of fully electric 1MW mining trucks. A number of startups are developing Small Modular Reactors in the 20MW to 500MW power output range, requiring extensive site development, construction and support resources, but Nano Nuclear Energy Inc. is uniquely positioned in the microreactor space with two commercial microreactor designs that output up to 5MWt with the complete electrical generator housed in an ISO shipping container.
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Devices are becoming more intelligent and can be tailored to be patient-specific, making a medical device that not only provides for the whole population, but can also really target the patient cohort or the target group of the disease or condition that must be treated or diagnosed.
There are many recent advances that have enabled medical advice development, from the sensors to the software, and in this episode, we talk to Dr. Visa Suomi from MathWorks about the complexity and inter-functionality of advanced medical devices.
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All electrical systems need power and these days most systems need a steady, efficient, and cost-effective source. Solutions like switched mode power supplies (SMPS) are now common but not necessarily easy to design or select.
Guest host Bill Wong talks with Frederik Dostal, a power supply expert with Analog Devices and also the author of the regular Dostal’s Design video/article series covering power supply design tips.
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Today’s system-on-chips (SoC) are very complex. They have multiple cores and often many different types of cores including CPUs, GPUs, and NPUs. Connecting these to peripherals and memory as well typically include one or more network-on-chips (NoC).
In this podcast, guest host Bill Wong talks with Andy Nightingale, VP Product Management and Marketing at Arteris, about NoCs.
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In this episode of Inside Electronics, Senior Content Director Bill Wong talks with Steve Brightfield, CMO at BrainChip, about neuromorphic computing in the form of spiking neural networks (SNN). SNNs take an event-based approach to artificial intelligence and machine learning (AI/ML).
Brainchip's Akido technology implements SNNs in hardware providing similar acceleration support that existing neural processing units (NPU) provide but with significantly better performance and lower power requirements.
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Industrial automation is getting real (time) with time sensitive networking (TSN). This open standard delivers determinism to Ethernet control networks and it works with wireless networks as well.
Senior Content Director Bill Wong talks with Tom Burke, Global Strategic Advisor, CC-Link Partner Association (CPLA) about how TSN works and why it is so important to industrial automation applications.
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The Maker Movement is a relatively new phenomenon in society...or is it? The desire to understand technology and create things is a drive that has existed in people since the first devices were created. We sit down with Electronic Design editors Andy Turudic and Cabe Atwell for a discussion about the Maker Movement, Tinkerers, and engineering.
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In this episode, Andy Turudic talks with Georgia Tech’s Professor Shaolan Li about their ECE department’s new analog IC design course where close to a dozen teams of three undergrad and one graduate student are fully hands-on designing real silicon, from schematic through tapeout, with resumption of the course to perform functional verification in a returning semester, after fabrication on a 300mm wafer by Texas Instruments.
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Making logic chips has never been an easy task, and it is one that has been further challenged by advances in scaling as well as advanced topologies like chiplets. From the race to 2nm-foundry creation for next-generation wafer development and the related issues of packaging, engineers must develop new solutions. In this episode, we talk to Henri Richard, GM and president of Rapidus Design Solutions, about the state of the art and the solutions his company is developing.
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The growth in high-performance computing and AI in advanced chip architectures is creating issues when it comes to intra-chip data management, especially as they migrate to chiplet-based topologies. Addressing this chip-level issue, Avicena announced its scalable LightBundle chiplet interconnect solution, offering ultra-high density die-to-die connections with a multi-Tbps/mm shoreline bandwidth density at sub-pJ/bit energy efficiency. In this podcast we talk to Bardia Pezeshki, Founder and CEO of Avicena, about the issues of intra-chip data management and his company’s solution.
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The increasing demand for high-performance computing for next-generation AI and advanced data centers is putting pressure on designers to field the latest data-management solutions. Addressing this demand, Rambus recently unveiled an updated PCI Express 7.0 IP portfolio, encompassing a comprehensive suite of IP solutions, as well as a controller IP for GDDR7 to allow for greater speeds and bandwidths to support generative AI workloads.
These applications consume memory at an unprecedented pace, and the new controller IP will unlock more memory for AI and high-performance computing applications, particularly in inferencing and at the network’s edge. In this podcast we talk with Lou Ternullo, Senior Director of IP Solutions at Rambus, about how the GenAI boom is pushing new advancements in innovations in the memory space.
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Addressing the need for low-power high-reliability connectivity in IoT solutions, Wi-Fi HaLow promises extended ranges, improved penetration capabilities, extended battery life, enhanced device density, higher level of security, and elevated data throughput in IoT scenarios. The Wireless Broadband Alliance (WBA) recently announced the Wi-Fi HaLow for IoT program has moved into a new phase, testing 802.11ah Wi-Fi HaLow solutions in real-world use cases, including a range of applications including smart home, smart city, building automation, smart retail, industrial IoT, and agriculture technology.
Tiago Rodrigues, CEO of the Wireless Broadband Alliance, talks about the trails and the overall IoT marketplace.
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Artificial Intelligence (AI) is evolving from a hot topic and buzzword to a real set of commercial solutions for business, industrial, medical, military, and consumer applications. The challenge in developing AI and Machine Learning (ML) solutions range from determining what kind of AI methodology should be implemented to the training and deploying AI- and ML-based solutions. Sam Fok, CEO of Femtosense, a company working on using Sparse AI for the real-time Edge applications, talks about the future of this technology.
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Creating products today is a challenging task, and not only because of the demands of the application. The sheer number of interrelated subsystems and the variety of core technologies involved make creating a product a task of integration and functionality convergence. In this podcast, we talk to John Leavitt, a Human Centered Designer and Product Developer at Intelligent Product Solutions, a product design and engineering services company that provides concepts for industrial design, mechanical engineering, embedded software, and systems architecture for companies developing products.
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The expansion of AI in the latest application spaces is creating problems at the board and chip level, as over 90% of the power consumption in AI workloads is from the movement of data. The ability to shorten data paths by moving the compute element closer to where the data is stored can reduce power consumption significantly.
This would also enable an unprecedented increase in compute density. In this podcast we talk to Robert Beachler, Vice President of Product at Untether AI, a company launched with the goal of addressing the major compute and efficiency bottleneck, memory access and data management.
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Industrial e-mobility applications require reliable and efficient solutions to manage high voltages and currents, and wide-bandgap semiconductors like Wolfspeed silicon carbide devices enable higher switching frequencies and greater power densities at much higher operating temperatures. In this episode, we talk to Guy Moxey, the VP of Power Development at Wolfspeed, about where we are and where he thinks the wide-bandgap industry is going.
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