Afleveringen
-
NEO Semiconductor introduces a groundbreaking 3D DRAM with integrated AI processing, aiming to replace current HBM technology and address data bus bottlenecks. Meanwhile, Apple's upcoming A18 chipset is expected to be featured across all iPhone 16 models, raising questions about potential specification differences between the 'Pro' and non-Pro versions.
-
TSMC plans to increase pricing for its advanced 5nm and 3nm process manufacturing by 2025. Meanwhile, Taiwan's stock market experienced a swift rebound following a steep decline but quickly mitigated those initial gains.
-
Zijn er afleveringen die ontbreken?
-
Nvidia's Next-Gen Blackwell Chip May Face Delays Due to Design Flaws
Nvidia's upcoming AI chips, known as the Blackwell series, are reportedly facing a delay of three months or more. This setback is attributed to design flaws that need to be addressed before the chips can proceed to production. -
Intel is attempting to recruit senior engineers from TSMC's Arizona facility, where TSMC manufactures chips for Intel. Meanwhile, TSMC has announced plans to establish its first European fabrication plant in Dresden, Germany.
-
TSMC exec emphasizes that the viability of Moore's Law is secondary to continued technology scaling, highlighting the role of 3D chip packaging in driving advancements. Despite Typhoon Gaemi, the most powerful typhoon to hit Taiwan in eight years, construction of TSMC's 2nm facility in Kaohsiung remains on schedule.
-
TSMC's Latest Results Show Its Role as an AI Innovator
Despite high costs and criticism from former President Trump, TSMC remains steadfast and on track with global chip mass production. The company's latest results underscore its position not just as a beneficiary of the AI boom, but as a key creator in the field. -
Chip stocks have experienced a significant decline, losing $480 billion in value due to concerns over U.S.-China trade relations and recent comments by former President Trump regarding Taiwan. Although ASML's stock saw a 49% increase in 2024, it faced downward pressure amid fears of potential Chinese export restrictions.
-
Title: TSMC Reports Earnings This Week: What to Expect
Description: Taiwan Semiconductor Manufacturing Company (TSMC) is set to release its earnings report this week. Investors and tech enthusiasts are eager to hear updates, particularly regarding the company's future innovations. Notably, the highly anticipated 2nm processor is projected to debut with the iPhone 18 Pro, offering a glimpse into the future of semiconductor technology. -
Upcoming Market Forecast and HBM4 Spec Finalization by JEDEC
This week, anticipate market updates and significant advancements as JEDEC nears the finalization of the HBM4 memory specification. The new specs promise up to 32 Gb densities in 16-Hi TSV stacks and speeds of 6.4 Gbps, indicating notable improvements in memory performance and capacity.
